_01-08-2020-preview-1.jpg "😱Взлом телеканала Карусель! Жуткий взлом телеканала! Дата взлома 01.08.2020 Взлом канала Карусель from Карусель 08 03 2028 Video Screenshot Preview 1")
Gallery_01-08-2020-preview-3.jpg "😱Взлом телеканала Карусель! Жуткий взлом телеканала! Дата взлома 01.08.2020 Взлом канала Карусель from Карусель 08 03 2028 Video Screenshot Preview 3")
Gallery_01-08-2020-preview-hqdefault.jpg "😱Взлом телеканала Карусель! Жуткий взлом телеканала! Дата взлома 01.08.2020 Взлом канала Карусель from Карусель 08 03 2028 Video Screenshot Preview hqdefault")
GalleryPlay Video:
(Note: The default playback of the video is HD VERSION. If your browser is buffering the video slowly, please play the REGULAR MP4 VERSION or Open The Video below for better experience. Thank you!)
Jump To Video Parts
⏲ Duration: 4 minutes 33 seconds
👁 View: 583.8K times
Play Audio:👁 View: 583.8K times
Description:
EZONT
EZONT
Share with your friends:
Whatsapp | Viber | Telegram | Line | SMS
Email | Twitter | Reddit | Tumblr | Pinterest
_western-australia-farmers-protest-government-plans-to-end-live-sheep-trade.webp "Nearly two-thousand Western Australia farmers and their supporters descended on Perth’s CBD this morning as part of a major protest against a ban on live sheep exports. The action was organised after the federal government introduced legislation to shut down the industry by 2028 due to ongoing animal welfare concerns.")
_09-03-23.webp "who are u")
_nvidia-looks-to-accelerate-production-with-new-packaging-tech.webp "Nvidia Looks to , Accelerate Production , With New Packaging Technology.<br/>Yahoo Finance reports that Nvidia Corp has announced <br/>plans to use Fan-Out Panel Level Packaging (FOPLP) <br/>technology to package its GB200 AI server chips.<br/>The change was reportedly made to address production constraints <br/>on the currently used Chip on Wafer Substrate (CoWoS) packaging <br/>used at the Taiwan Semiconductor Manufacturing Company.<br/>The change was reportedly made to address production constraints <br/>on the currently used Chip on Wafer Substrate (CoWoS) packaging <br/>used at the Taiwan Semiconductor Manufacturing Company.<br/>According to industry experts, FOPLP <br/>could be a viable alternative to CoWoS <br/>amid the increasing demand for AI chips. .<br/>Analysts consider Nvidia the premier accelerated <br/>compute and generative AI supplier, backed <br/>by production plans with Blackwell Chip. .<br/>Over the past year, stock in <br/>Nvidia has gained over 184%. .<br/>On May 29, shares in Nvidia were up <br/>0.89% at $1,149.10 in premarket trading. .<br/>Yahoo Finance reports that a growing <br/>number of packaging companies are <br/>getting ready to offer FOPLP services. .<br/>Yole Group has predicted that <br/>its market share will increase <br/>from 2% in 2022 to 8% by the year 2028.<br/>The gains are expected to primarily <br/>be driven by higher yields and <br/>increasing cost efficiency.<br/>Experts point out that while FOPLPs could reduce cost <br/>and expand capacity, they have weaker technical <br/>specifications compared to the current CoWoS standard")
_27-2023.webp "Самый лучший 34")
_2024.webp "Mega Gamer Yt")
_western-australia-farmers-protest-government-plans-to-end-live-sheep-trade.jpg)
_09-03-23.jpg)
_nvidia-looks-to-accelerate-production-with-new-packaging-tech.jpg)
_27-2023.jpg)
_2024.jpg)
![[+]](/images/menu.gif){kind=small}